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Ticket #1758156

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AOI US Closed

Red Flex board extraction issue

CustomerNot indexed
CompanyNot indexed
Priority2
TypeFYI-No Action Required
UpdatedMay 24, 2026 at 6:30 PM
Thread2 messages
Ticket metadata
Group
AOI US (150000419797)
Status
Closed (5)
Created
Apr 29, 2026 at 4:11 PM
Requester
Not indexed
Company
Not indexed
Last synced
Aug 3, 2026 at 1:49 AM
Resolved
May 14, 2026 at 2:32 PM
Closed
May 22, 2026 at 6:23 PM
Tags
A - AOI CASE ACK EN, A - 1 Hour Delay rslv, AOI - New CSAT Sent, LOCKED

Current case

Customer issue

Hello team, I'm currently working on a red flex board, and I've hit a wall with extraction. In the attached screenshots you can see that we're having major extraction issues with component top, as well as lands. These images are from before and after I have tried using the PCB characteristics parameters editor and have added an adjustment image to train base plane manually. What can I do accurately extract components and lands on this board? Thank you, -William Duke, Touchpad Electronics

Conversation

Engineer and customer thread

2 messages
  1. Omron Application Engineer Omron reply | Apr 29, 2026 at 4:42 PM
    Hello Williams, Did you adjust the warpage from -2~3 to -6~6 from the base plane editor as well? If the warpage on the flex PCB is more that 6 then system cannot accommodate it. The only way to address this issue to use a pallet to inspect the board. If the warpage is under +/-6 then please check the fiducial and the position correct colors. Please assign only the pad colors to the land area. Please check the physical placement of each component as well on the program. ​Do you have TeamViewer available on the teach station? Please let me know and I can take a look. Best Regards
  2. Omron Application Engineer Omron reply | May 14, 2026 at 4:25 PM
    No sanitized conversation text indexed.