AOI US Closed

Components Misaligned

CustomerNot indexed
CompanyNot indexed
Priority2
TypeFYI-No Action Required
UpdatedJun 29, 2026 at 11:27 AM
Thread2 messages

Current case

Customer issue

Good Afternoon I seem to be getting a lot of misalignment in multiple components of my program. I started the program as I normally would I got my images, I got my fiducials, registered my components. I took another image to see if maybe the fiducials weren't taught correctly but it all seems correct. Please review image so you could get a understanding of what I'm seeing. Thank you ________________________________ From: AOI Tech Support - US Sent: Thursday, May 14, 2026 11:18 AM To: Jose Luis Andres Cc: Stephanie Ruelas Subject: Re: electrode wettability vs land wettability [Case: 1768786] This email came from outside your organization! This email was received from outside your organization. Use caution when following links or opening attachments, as they could open malicious web sites or execute unwanted programs. - Emerald Technologies Information Security ________________________________ Good afternoon Luis, Electrode wettability and land wettability are related, but they evaluate different areas of the solder joint. Land wettability evaluates how well the solder wets/spreads across the PCB land/pad area. This inspection is focused on the solder condition on the land side. If solder does not spread sufficiently on the land, or if exposed land remains, this can indicate insufficient wetting or insufficient solder coverage. Electrode wettability evaluates how well the solder wets to the component electrode/termination. This inspection is focused on the solder connection at the component side, such as the electrode toe/end or side area. The system checks the wetting angle between the solder and the component electrode. If the solder joint to the electrode is not sufficient, the system may report an electrode wettability warning or fault. The Omron manual describes this type of result as occurring when the solder joint with the electrode is not sufficient, when solder wetting height is low, or when the solder joint width/side wetting is not sufficient. For this type of evaluation, the main items to confirm are: 1. Actual solder condition * Confirm whether there is enough solder volume at the component termination. * Confirm whether the solder is visibly wetting up to the electrode/toe area. * A low solder condition can pass land wettability but still show concern at the electrode if the solder does not sufficiently contact or climb the component termination. 2. Land window and electrode window position * If the land window, electrode window, electrode tip, or electrode side extraction is not aligned correctly, the system may evaluate the wrong area. * The teaching manual specifically lists incorrect land window position, incorrect component/electrode extraction, incorrect electrode tip extraction, incorrect electrode side extraction, and incorrect electrode window size as possible causes for wetting errors. 3. Color/fillet extraction settings * These inspections are based on solder color detected in the land window. * If the fillet excluded color or solder/metal color extraction is not set correctly, the system may not correctly recognize the solder area. This can cause a false low-solder or wettability warning. 4. Inspection criteria * Electrode wettability includes items such as Center of Toe, Both Ends of Toe, Center of Side, and Both Ends of Side. * The logic manual indicates that a wettability error can be output if the joint angle between the electrode and solder is outside the set criteria, or if solder is not detected in the inspection range. One additional item we noticed from the screenshot is that Electrode Wettability is not currently enabled for inspection. Only Land Wettability – Center appears to be selected. Since this is a QFN / no-lead style component, the setup of the “lead/electrode” extraction boxes is still important because the system uses those boxes to determine the correct solder/electrode relationship at the edge of the package. In the image provided, several of the blue lead/electrode boxes do not appear to be centered correctly within the land pad boxes. Before adjusting inspection thresholds, we recommend manually correcting the lead/electrode box positions in the Inspection Registration tab so they are centered on the pads and aligned to the package edge. If these boxes are shifted, the system may evaluate the wrong area and report low solder or wettability concerns even when the actual solder joint may be acceptable. Does this help answer your questions? Let us know, thanks. [https://outlook.office.com/mail/id/AAkALgAAAAAAHYQDEapmEc2byACqAC%2FEWg0ADpwfwe5VlUOacFhznhOZYwACULfCUAAA?nativeVersion=1.2026.602.400][https://outlook.office.com/mail/id/AAkALgAAAAAAHYQDEapmEc2byACqAC%2FEWg0ADpwfwe5VlUOacFhznhOZYwACULfCUAAA?nativeVersion=1.2026.602.400] [This is Jeremiah Soliz's card. Their email is [email] Their phone number is +[phone].] On Thu, 14 May at 12:36 PM , Jose Luis Andres wrote: Good morning, I am seeking to gain a deeper understanding of the following inspection item: electrode wettability in comparison to land wettability. What specific criteria should be considered in this evaluation? With respect to this component, it is noteworthy that an assessment of its electrode wettability frequently results in a warning indicating very low solder levels. J. Luis Andres AOI Supervisor P [phone] ext 231 ITAR Disclaimer: This message, including any attachments, is for the sole use of the intended recipient(s) and may contain confidential and privileged information. Any unauthorized review, use, disclosure or distribution is prohibited. ITAR CONTROLLED This correspondence may contain Technical Data whose export is restricted by the Arms Export Control Act (Title 22, U.S.C., Sec 2751, et seq.). Violations of these export laws are subject to severe criminal penalties. This data may not be resold, diverted, transferred, transshipped, made available to a foreign national by any means. 1768786:2549832 ITAR Disclaimer: This message, including any attachments, is for the sole use of the intended recipient(s) and may contain confidential and privileged information. Any unauthorized review, use, disclosure or distribution is prohibited. ITAR CONTROLLED This correspondence may contain Technical Data whose export is restricted by the Arms Export Control Act (Title 22, U.S.C., Sec 2751, et seq.). Violations of these export laws are subject to severe criminal penalties. This data may not be resold, diverted, transferred, transshipped, made available to a foreign national by any means.

Conversation

Engineer and customer thread

2 messages
  1. Omron Application Engineer Omron reply | Jun 15, 2026 at 8:24 AM
    Hello Stephanie, There can be multiple causes for component misalignment, and fiducials are one of the key factors. Please ensure that all components are properly aligned using the Inspection Registration screen. Also confirm that both the PCB lands (pads) and components are accurately extracted. Kindly review the following items: 1. Fiducial Colors Ensure that the fiducial colors are correctly extracted. Verify that there is no surrounding noise or distortion affecting fiducial recognition. 2. Position Correction Colors Check the position correction color settings under: Tool → PCB Image Management → Edit Model → PCB Characteristic Parameters Ensure these colors are configured correctly for accurate alignment. 3. Component Alignment Review each component individually in the Inspection Registration tab to confirm proper alignment and orientation. 4. Rail Width Verify the PCB rail width. Ensure there is no excessive clearance that could allow the PCB to tilt or stop at an angle during positioning. Please let me know if you have any questions. Saqib Toor Sr. Application Engineer Mobile: [phone] Emai: [email] Omron Automation Americas 2895 Greenspoint Parkway, Suite 200, Hoffman Estates, IL 60169 automation.omron.com [email]
  2. Omron Application Engineer Omron reply | Jun 19, 2026 at 9:26 AM
    No sanitized conversation text indexed.