________________________________ From: Vitkovskis, Arthur A Sent: Thursday, 23 July 2026 08:23:17 To: Francisco Villalpando / OEI ; Tony Lee / OEI Cc: Pallman, Scott J. Subject: SPI Noise and Paste Dot Issue Hello Francisco/Tony, Hope you guys are doing well. We are trying to run some trials for applying paste dots on some of our pad locations and are running into an issue. It seems like when we apply paste dots to these pads it sometimes creates a bunch of noise throughout the squee-geed solder paste deposit in the 3D view and it causes the top of the paste dots to be concave when they should be convex. I plan on creating a new SPEC for parts that have these paste dots anyways, but was trying to use the current SPEC thinking they would get rejected and display the total volume and slice area values of the paste on those pad for me to use in the new SPEC, but it turned out they passed but it was likely due to the noise and the fact that it thought the paste dot mounds were “craters” instead. I’ve attached a couple images of what we are seeing, do you guys have any suggestions on tweaks we can make so that the results are more representative of what the paste actually looks like on these pads? Thanks, Arthur Vitkovskis Electronics Process Engineer Ph: [phone] Email: [email] [email] ________________________________ DISCLAIMER: This e-mail may contain ITAR controlled technical data as defined by 22 CFR 120.33 and/or EAR controlled technology as defined by 15 CFR 772.1 and may not be forwarded or disclosed to any Foreign Person, as defined under the regulations, without the prior written consent of Ensign-Bickford Aerospace & Defense and the United States Department of State or United States Department of Commerce. WARNING! This is an email from an external party. Do not click on any link or open any attachment if you cannot ascertain that it is safe.
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Engineer and customer thread
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Saqib ToorOmron reply | Jul 23, 2026 at 10:13 AM
Hello Arthur, All is well on this side. Are these paste dots on the top of the paste? The noise is probably caused by the solder paste light settings. Could you please check the Solder Paste and 3D Lighting settings and eliminate the surrounding noise.? Please manually configure the lighting parameters according to the attached manual and let us know whether this improves the inspection results and reduces the noise/paste dot issue.
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CustomerCustomer reply | Jul 23, 2026 at 10:22 AM
Hello Saqib, I will look into the parameters sometime today/next week. The paste dots are on top of the squee-geed paste deposit.
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Saqib ToorOmron reply | Jul 24, 2026 at 10:31 AM
Hello Arthur, Thank you for the update. Since the paste dots are being applied on top of the squeegeed solder paste deposit, the behavior you described is still consistent with a 3D measurement/lighting issue rather than an actual paste shape issue. Once you have an opportunity to review the Solder Paste and 3D Lighting settings, please let us know if the shape and noise level has improved. I'm interested in seeing if the concave appearance of the paste dots has improved after the lighting optimization. Please keep in mind that system calculate the average height and volume. The paste dots above the height of stencil will affect the height and volume of the paste and you may have to use a separate SPEC data for this product.
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CustomerCustomer reply | Aug 5, 2026 at 4:16 PM
Hey Saqid, Working through the document, it seems like the noise has gotten better but no matter what I change it does not affect the paste dots, they still come out as craters rather than mounds as we expect. The closest I got was lowering the “3D Inspection” value in the “4 Solder Insp” tab. When it was at the default value of 70 the mounds came out as blue, which the document mentioned height was not being extracted. When I lowered it, the blue went away when in the Light Adjust setting but when I ran an inspection the paste dots results came flat as if it was squeegeed paste rather than the extruded mounds. Thanks, Arthur Vitkovskis Electronics Process Engineer Ph: [phone] Email: [email] [email]
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Francisco VillalpandoOmron reply | Aug 5, 2026 at 6:44 PM
Hello Arthur, What is the height of these solder paste deposits, and what is the stencil thickness? By default, the SPI system can inspect solder paste deposits up to 300 µm in height. Francisco Villalpando Engineering Supervisor Direct: +[phone] [email]